Hardware Design Service

Microcontroller, Processor & FPGA

Wireless Technologies

Hardware Design Capabilities

Architecture:

Processor: Arm Cortex-A5, A7, A8, A9, A17, A53, A72.
Microcontroller : Arm Cortex-M0, M0+, M3, M3 +, M4, M7.
BIT : 8, 16, 32, 64.

Processor :- iMx8, STM32MP15x, AM335x, RK3399.

Memories:- DDR2, DDR3, LPDDR3, DDR4, NAND-Flash, NOR-Flash, eMMC, SPI-Flash, SDRAM, SD/SDIO/MMC.

Multimedia :- Audio, Video, Camera.

HMI:- LCD, MIPI-DSI, MIPI-CSI, LVDS, HDMI, DVI, Keypad, ePaper Display (EPD)

Wired Connectivity:- USB, Ethernet, CAN

Wireless Connectivity:- Satellite Communication, 2G, 3G, 4G, LTE, NB-IoT, Bluetooth, BLE, Wi-Fi, RFID, IR, GPS, sigfox, Thread, LoRa, ZigBee, Matter, RC-5 & RC-6.

Peripherals:- USART, I2C, SPI, SAI, I2S, GPIO, CAN, LIN, FlexRay, A/D, D/A

Industrial Interfaces:- 0-10V Digital Input, 0-10V Digital Output, 0-10V Analog Input, 0-10V Analog Output, 4-20mA, RS-232, RS-485

Sensor & Actuator:- Time of Flight (ToF), Magnetometers, Accelerometers, Humidity, Pressure, Temperature, Thermocouple

Power:- Power Management, Reverse Voltage Protection, ESD & Transient Protection, Power Isolation, Power Over Ethernet (PoE)

Motors Driver:- DC Motor, BLDC, Stepper, Micro stepper, Servo

Security Chips:- AES Encryption

Schematic & PCB Design Capability

Schematic Design :

Hierarchical Design.
Schematic capture.
Component selection.
Library creation.
3D Model creation.
Design Verification.

PCB Designs :

Multi Layer Design - 2, 4, 6, 8, 12 Layers.
Mixed speed, Mixed signal Design.
RF Design.
HDI : High Density Interconnect.
Ultra Low Power, Battery Powered & Solar Powered Design.
High Voltage, High Current, High Power Design.
PCB Layer Stackup design as per manufacturer.
Controlled impedance design.
Signal Integrity, Power Delivery Network & Thermal analysis.
Transient, ESD, EMI, EMC Compliant based design.
Advance simulation & 3D Modelling.
Packages: uBGA, BGA, Fine pitch, QFN, 0402, upto 01005.
Blind, Buried via, via in pad, Laser micro vias.
Rigid & Fex PCB design.

Board Type :- System On Module, Compute Module, Package On Package, PCIE

3D Model :- Altium, Blender.

CAD, Simulation & Equipments

Signal Integrity :- HyperLynx.

PCB Design :- Altium, Autodesk Eagle.

Simulation :- LT Spice, Pspice.

Multi Layer Design - 2, 4, 6, 8, 12 Layers
High Speed Digital

Tools & Equipments :- Function generator, DSO, DMM, Logic Analyzer, Labbench PSU - Linear & SMPS, Soldering station, Microscope.

Bill Of Material (BOM)

BOM Optimization for high volume production.
BOM selection as per longevity, availability, reliability, cost, process & supply chain consideration.
Components sourcing from multiple local & International vendor.
International Distributors : Mouser, Arrow, Avnet, Element-14.

Manufacturing, Assembly & Testing

Manufacturing :

Design for Manufacturability (DFM) in association with manufacturers.
Design for Testability (DFT) in association with manufacturers.
High volume production in EMS as per IPC standards.
Turnkey manufacturing & direct dispatch from EMS partners across India (Pune, Ahmedabad, Mumbai).

Assembly - EMS :

Automatic Paste Printer.
Assembly using high speed pick and place machine.
Soldering in reflow Oven.
Soldering in wave soldering machine Robust Testing.
Visual Inspection.
- AOI - Automated Optical Inspection.
- X-Ray.
Electrical Testing.
- Custom Test Jig for ICT, FCT, FVT.
- ICT : In Circuit Testing.
- FCT : Functional Circuit Testing.
- FVT : Functional Verification Testing.
- Automatic test report generation & storage in Online & Offline database

Yantrify is an Electronics Product Design, Development and Manufacturing company based in Nagpur, India. We are dedicated to designing embedded system and Edge IoT solution that focus on adding value to our customer's business

Company

Contact

Nagpur, Maharashtra, India, 440024